Die Sort Module Engineer (Contract)

Job Details:

Job Description: 

In this position, you will be responsible to improve the process and equipment performance of SDx Module in KMDSDP organization. The Role and Impact: - Drive module and equipment excellence by leading a continuous improvement for test equipment and module performance, focusing on New Product-Technology Introduction (NPI-NTI) to meet and exceed safety, quality, productivity, and cost targets for High-Volume Manufacturing (HVM). Support strategic HVM ramp and roadmap alignment by collaborate with technology development and partner factories to define critical process parameters for successful product ramps. Proactively manage capacity by aligning with the product roadmap, ordering collaterals, and qualifying tools. Guide a small team to support critical factory projects, including tool and equipment installations, while fostering a collaborative environment. Business Group - As part of Intel's Wafer Packaging Manufacturing group, you will join a globally recognized organization at the forefront of semiconductor packaging. We design, develop, and deliver innovative factory solutions to meet evolving technology needs. With a commitment to driving advancements in high-density modular assembly, computing, and connectivity, our group fosters a highly collaborative and innovation-driven environment to enable Intel's success in its core business areas. Key Responsibilities: - Provide hands-on support by troubleshooting process and equipment NPI/NTI/HVM escalations from Supervisor, Shift MT or ES. Focus on technical problem-solving and analysis by conducting detailed data analysis to resolve complex issues and ensuring tools are production-ready to support factory module NPI/NTI and HVM operations. Demonstrate strong experience in die/wafer sort, test programming, and debug methodologies. Work independently with minimal supervision, utilizing scripting or statistical tools to analyze data and drive decisions.

Qualifications:

- Bachelor/Master Degree in Electrical / Electronics / Mechanical/ Mechatronics and Materials Engineering. - Good knowledge experience in semiconductor back-end assembly, specifically on tool and equipment qualification for test and metrology NPI/NTI/deployments will be an added advantage. - Basic understanding of Statistical Process Control (SPC), statistical data analysis, and structured problem-solving methodologies. Expertise in Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), and Root Cause Analysis (RCA) will be an added advantage. - Good communication skills with the ability to collaborate in cross-functional team environments and present technical data clearly.

Job Type:

Intel Contract Employee

Shift:

Shift 1 (Malaysia)

Primary Location: 

Malaysia, Kulim

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.