Principal Product Engineer - Memory IP
Cadence · Nanjing, China +1 · 1mo ago
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
Primary Responsibilities:
○ Supporting pre-silicon integration, usage, and implementation of memory subsystem products
○ Helping with internal system integration and QA testing of memory subsystem products (Controller + PHY)
Analyzing and resolving complex subsystem application or implementation issues and providing
professional guidance to customers
○ Supporting various memory PHY and controller SOC integration reviews and implementation reviews
○ Assisting customers with RTL and gate-level simulations to verify functionality
○ Assisting customers with timing closure and other aspects of physical integration
Participating in development and refinement of product documentation and checklists for customer
applications
○ Supporting post-silicon bringup and production test activities for customers as needed
Enhancing customer experience by providing prompt, thorough, and technically accurate responses to
customer questions
○ Leveraging AI-powered tools and assistants to enhance productivity, improve decision making, and maintain
high-quality customer deliverables.
○Applying AI-powered analytics tools to extract insights, identify patterns, and generate actionable
recommendations from complex datasets
Position Requirements:
○ B.S Electrical/Computer Engineering (or similar degree) and 7+ years of overall experience -OR- M.S
Electrical/Computer Engineering (or similar degree) and 5+ years of overall experience
○ Experience working with DDR5/4/3, LPDDR5/4/3, HBM3, GDDR6 or similar IPs
○ Verilog RTL design and gate level verification experience
○ Synthesis and static timing analysis experience (physical implementation/verification experience is a plus)
○ Familiarity with industry standard DFT flows and test methodologies.
○ Familiarity with package and board design
○ Ability to read schematics and participate in SI/PI reviews for customer board/package implementation
Preferred Qualifications
○ Experience with Memory PHY and DSP based architecture
○ Experience with embedded microcontroller FW
○ Background with scripting and applying AI solutions to daily workflows