Advanced Packaging Cryogenic Modeling Engineer

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundriesmakespossible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visitwww.gf.com.

Summary of Role:GlobalFoundries isseekingan experiencedthermal,mechanical, and/or electrical modeler/engineer withdemonstratedcryogenic modeling experience to support cryogenic packaging and system co-optimization R&D. The engineer will leverage commercial multi-physics tools to build, correlate, and apply models that capture low-temperature material property behavior and thermo-mechanical effects (e.g., thermal contraction and CTE mismatch) to guide device, integration, and cryogenic 3DHI advanced packaging optimizations for mechanical, thermal, and/or electrical performance.

Essential Responsibilities:

• Demonstrated experience using commercial software to develop and correlate cryogenicthermal,mechanical, and/or electrical models for semiconductor devices and advanced packages (e.g., 77 K and below), including temperature-dependent material properties and boundary conditions.

• Stress simulations for continuous and discontinuous active areas, and how stress affects device performance if the skill is mechanical modeling. 

• Anticipate integration/process issues, based on provided information from integration, process or design enablement teams and performed modeling. 

• Facilitate discussion withoriginatingteam toidentifysimulations that highlight critical process interactions and driveoptimal3DHI technology decisions.

• Apply commercial simulation software to mimiccryogenicsemiconductor process flows and highlight the areas of concern.

• Extensive interaction with integration, device, and design engineers toassuredevelopment ofa workingtechnology.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Securityrequirementsand programs. 

• Other duties as assigned bymanager.

Required Qualifications:

• M.S. + minimum of10years of relevant experience.

• Semiconductor mechanical,thermaland/or electrical simulation tool experience with Ansys Mechanical Workbench or other applicable software for any of those 3 modeling applications.

• Strong problem solving and technical trouble shooting skills including expertise in design of experiment.

• Must have at least an overall 3.0 GPA and proven good academic standing.

• Language Fluency - English (Written & Verbal).

• Solid understanding of semiconductor processes and integration techniques.

• Good computer / software skills.

• Ability to clearly present results to small and large groups.

• Travel - Up to 10%.

Preferred Qualifications: 

• PhD +8years of relevant experience.

• Thermal and electrical simulation for specific IC circuit designs (RF analog experience preferred) and with LVS and DRC verification tools (Cadence / Mentors Graphics / Keysight ADS…).

• Demonstrated work performance in an environment requiringa highlevelof attention to detail and timeliness.

• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. 

• Project management skills,i.e.the ability to innovate andexecutesolutions that matter; the ability to navigate ambiguity.

• Strong written and verbal communication skills.

• Strong planning& organizationalskills.