Global OSAT Operation Engineering
NXP Semiconductors · Singapore · 12d ago
Mid levelOn-siteSoftware Engineering
Job Responsibilities:
- Provide technical leadership for yield, quality, reliability, and productivity improvement programs across OSAT sites.
- Drive manufacturing excellence initiatives including cycle time reduction, bottleneck elimination, equipment qualification, and process optimization.
- Review and approve subcontractor 8D, CQC, Safe Launch reports, PCN submissions, and corrective/preventive action plans.
- Drive manufacturing excellence initiatives including cycle time reduction, bottleneck elimination, equipment qualification, and process optimization.
- Drive qualification and implementation of subcontractor changes including material, equipment, process, manufacturing site, floor layout, and capacity expansion for supply assurance.
- Lead OSAT site transfer, second-source qualification, and capacity expansion projects for supply resilience and revenue growth.
- Own qualification planning, gap assessment, risk mitigation, Safe Launch execution, and PCN activities.
- Partner with global Product Engineering, Quality, Reliability, Supply Chain, and Manufacturing teams to ensure successful project execution and product commercialization.
- Lead supplier technical assessments, capability benchmarking, and readiness reviews for new and existing OSAT partners.
- Lead onsite root cause investigations and resolution of major quality incidents, yield excursions, customer issues, and severe incident escalations.
- Support package documentation management, including bond diagrams, package kits, assembly flows, qualification reports, and change records.
- Participate as Change Action Board (CAB), Independent Review Board(IRB), and qualification review member for NPI/NTI, site transfer, and process change approvals.
- Champion Smart Factory initiatives by working with OSATs on AI/ML deployment, predictive analytics, automated defect detection, and manufacturing digitalization solutions.
- Provide regular executive updates and recommendations to management on qualification status, supply risks, quality performance, and strategic OSAT initiatives.
Requirements:
- Degree or MSc Degree in Mechanical, Materials, Manufacturing, Electronics Engineering or equivalent.
- Minimum 8-10 years of semiconductor assembly and packaging experience, preferably in OSAT management, site transfer, and qualification projects.
- Technical knowledge in advanced packaging technologies such as WLCSP, FOWLP, Cu Pillar Bumping, and Flip-Chip. Additional experience in mainstream semiconductor packages including QFN, LQFP, and wire bond technologies will be an added advantage.
- Experience in package qualification, Safe Launch execution, change management (PCN), and subcontractor management. Knowledge of DOE, SPC, FDC, process control methodologies, reliability qualification, and root cause analysis techniques.
- Proven experience in yield improvement, quality management, and manufacturing productivity enhancement.
- Strong project management, leadership, and stakeholder management skills in a cross-functional global environment.
- Good communication and presentation skills with the ability to influence stakeholders at all organizational levels.
- Ability to work independently, manage multiple priorities, and drive projects to closure under tight timelines.
- Familiarity with AI/ML, Smart Factory, Industry 4.0 initiatives, and manufacturing digitalization is an added advantage.