Signal and Power Integrity Engineer, Senior to Staff Level
Qualcomm · Hsinchu City, Taiwan · 11d ago
Company:
Qualcomm Semiconductor LimitedJob Area:
Engineering Group, Engineering Group > Packaging EngineeringGeneral Summary:
Job Overview
The Qualcomm CHS (Central Hardware System) team has exciting opportunities in the areas of Signal Integrity and Power Integrity (SIPI) for next-generation server projects. The candidate will work closely with IC, Package, and PCB designers to optimize overall system performance.
The role involves partnering with substrate designers to ensure all system-level constraints are met before package tape-out and collaborating with PHY owners to understand requirements for various IPs such as LPDDR6, PCIe, and 224G interfaces. The candidate will also work with PCB designers to assess the impact of ball assignment on system-level performance.
This position offers the opportunity to work across multiple organizations, including IP, Package, PCB Design, and Simulation teams.
Responsibilities
- Perform package and PCB extraction for time-domain and frequency-domain analysis.
- Conduct system-level analysis for DDR, SerDes, and Power Delivery Network (PDN).
- Develop design guidelines for Package and PCB design.
- Create technical documentation and presentations.
- Collaborate with cross-functional teams to optimize signal and power integrity performance across the system.
Minimum Qualifications
- 3+ years of experience in DDR/SerDes, Package, PCB, or System Design related to Compute, Automotive, and/or Server products.
- Strong background in Electromagnetics, transmission line theory, and crosstalk analysis.
- Experience with field solvers such as HFSS, Q3D, Sentinel-PSI, and Clarity.
- Experience with simulation tools such as ADS and HSPICE.
- Working knowledge of Cadence Allegro/APD/SIP or Mentor Xpedition.
Preferred Qualifications
- Experience utilizing AI tools to improve engineering efficiency.
- Experience with MATLAB and/or programming languages.
- Knowledge of design specifications such as LPDDRx, PCIe, and XLink.
- Master's degree or Ph.D. in Electrical Engineering or a related field.
- Candidates with a broad range of experience will be considered, from Senior to Staff levels based on qualifications and demonstrated expertise.
Minimum Qualifications:
• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.
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