Staff Failure Analysis Engineer - Advanced Packaging Technologies
Qualcomm · San Diego, United States · 10d ago
Company:
Qualcomm Technologies, Inc.Job Area:
Engineering Group, Engineering Group > Hardware EngineeringGeneral Summary:
We are seeking a highly skilled and motivated Failure Analysis Engineer to lead the development and enablement of FA test interfaces, advanced socketing, and thermal management solutions in support of Electrical Fault Isolation (EFI). This role plays a critical part in enabling design debug, yield improvement, and RMA analysis across Qualcomm’s diverse product portfolio.
With the rapid emergence of Cloud, Compute, and Automotive products featuring large package sizes, high pin counts, and advanced packaging technologies, traditional design and process flows for FA testing are increasingly challenged. The successful candidate will develop innovative hardware methodologies and FA‑specific interface solutions to ensure robust and scalable fault isolation capability for next‑generation products.
Minimum Qualifications:
• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.
Key Responsibilities
- Lead FA test interface enablement across all Qualcomm product lines, including Mobile, Compute, Automotive, Networking, and AR/VR Embedded platforms.
- Proactively plan, develop, and deploy FA‑specific hardware such as custom sockets and carrier boards to support both ATE‑based and platform‑based testing environments.
- Define and optimize the minimum viable set of socket and interface variants required to support comprehensive FA test scenarios, ensuring hardware readiness by Silicon on Dock (SOD).
- Design, evaluate, and deploy thermal management solutions tailored to FA use cases for high‑power (high‑TDP) devices across Cloud, Compute, and Automotive segments.
- Utilize thermal and electrical analysis tools to assess performance, reliability, and feasibility of FA hardware solutions.
- Develop detailed hardware specifications and collaborate closely with internal teams and external suppliers to integrate socketing and thermal solutions into the FA workflow.
- Partner with cross‑functional teams including Design, Product Engineering, Yield, and Reliability to align FA hardware capabilities with evolving product requirements.
- Continuously evaluate emerging technologies and packaging trends to evolve FA interface and socketing strategies.
Preferred Qualifications
- Strong foundation in electrical engineering with hands‑on experience in hardware design, test interfaces, or FA enablement.
- In‑depth understanding of socketing technologies, power delivery challenges, and signal integrity for advanced semiconductor packages.
- Experience supporting FA or debug activities for complex SoCs, high‑pin‑count devices, or large advanced packages.
- Familiarity with thermal analysis and mitigation techniques for high‑power semiconductor devices.
- Ability to translate FA requirements into clear, actionable hardware specifications.
- Strong collaboration and communication skills to work effectively across multidisciplinary and global teams.
Education Requirements
- Required: Bachelor’s degree in related discipline.
- Preferred: Master’s degree in Electrical Engineering or related discipline
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Pay range and Other Compensation & Benefits:
$141,300.00 - $211,900.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.