Senior Engineer - IC Package Design

Company:

Qualcomm India Private Limited

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

General Summary:

Role Overview

We are seeking anIC Package Design Engineer to support theplanning, coordination, and execution of IC package design activities across complex semiconductor product development programs.

This role emphasizesprogram execution, cross‑functional coordination, and delivery predictability, supporting package design efforts fromearly feasibility and design planning through tapeout and manufacturing readiness. The engineer will collaborate closely withpackage designers, integration engineers, SI/PI teams, manufacturing partners, and operations teams to ensure alignment, issue tracking, and timely delivery of package milestones.

EDA tools and automation are used primarily asenablers of execution, while the core focus of this role is ondriving clarity, managing dependencies, and reducing execution risk.

Minimum Qualifications:

•    Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.

Key Responsibilities

Program Execution & Coordination (Primary Focus)

• Support execution of IC package design programs fromearly design planning through tapeout and post‑tapeout support.

• Develop and maintainexecution plans, schedules, task lists, and milestone trackers.

• Trackrisks, issues, dependencies, and action items across package design, verification, and manufacturing activities.

• Driveaction item follow‑up, escalation, and closure with clear ownership and timelines.

• Prepare and deliverstatus updates, execution summaries, dashboards, and readiness reports for project and engineering stakeholders.

• Support design reviews and execution checkpoints by coordinating inputs, capturing outcomes, and tracking follow‑up actions.

• Useproject and program management tools (e.g., dashboards, Gantt charts, milestone trackers, dependency maps) to provide clear visibility into execution status.

Cross‑Functional & External Engagement

• Coordinate acrossPackage Design, Package Integration, SI/PI, and Operations teams to ensure execution alignment.

• Work closely withPackage Process teams to align design assumptions with manufacturing capabilities, process constraints, and yield considerations.

• Interface withNew Product Introduction (NPI) teams to support package readiness for qualification, ramp, and high‑volume manufacturing.

• Partner withSubstrate Engineering & Technology teams to track substrate development, availability, risks, and schedule alignment.

• Engage withOSATs and Suppliers to support execution readiness, resolve blocking issues, and ensure manufacturability alignment.

• Coordinate with EDA and tooling teams to ensuredesign flows and tools are ready to support program needs.

Design, EDA & Process Enablement (Supporting / Enabling Role)

• Use existingpackage design flows, EDA tools, reference methodologies, and execution checklists to support program execution.

• Draft, document, and maintain process flows that clearly define execution steps, handoffs, inputs, and outputs across the package design lifecycle.

• Developclear, structured documentation describing:

  • Package design and execution workflows

  • Design release and handoff steps

  • Readiness checks and acceptance criteria

  • Common issues, failure modes, and escalation paths

• Translate complex technical activities intorepeatable, well‑defined process steps that can be consistently followed across teams.

• SupportEDA and design‑flow issue triage, coordinating with subject‑matter experts and tool owners as needed.

• Apply light scripting or automation where helpful to supportreporting, consistency checks, or process enforcement.

• Capturelessons learned and best practices and incorporate them into updated process documentation and workflows.

Required Skills & Experience

Program & Execution Skills (Core)

• Experience supportingcomplex, cross‑functional engineering programs.

• Strong organizational skills with the ability to managemultiple workstreams in parallel.

• Experience usingproject / program management tools, including:

  • Execution dashboards

  • Milestone and dependency trackers

  • Gantt charts or schedule views

  • Action‑item and risk tracking tools

• Comfortable driving execution inmatrixed organizations without direct reporting authority.

• Strong written and verbal communication skills.

Technical Context (Enabling)

• Familiarity withIC package development lifecycles and execution flows.

• Working knowledge ofIC package design, layout, integration, or manufacturing concepts.

• Exposure to package design or EDA tools such as:

  • Cadence APD / SIP

  • Cadence Innovus / Virtuoso

  • Mentor Xpedition

  • Valor and RAVEL

• Scripting or automation experience (e.g.,Python, TCL) is a plus but not required.

Minimum Qualifications:

•    Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.

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