Mixed-Signal IP Memory & Die-to-Die (D2D) System Engineer - Cork, Ireland

Company:

QT Technologies Ireland Limited

Job Area:

Engineering Group, Engineering Group > ASICS Engineering

General Summary:

Job Description

Qualcomm's Memory and Connectivity Systems team is seeking talented Memory and Die-to-Die (D2D) Systems Engineers to join our growing Mixed-Signal IP engineering organization in Cork, Ireland.

As part of a world-class team developing next-generation SoCs, you will contribute to the architecture, modelling, analysis, and optimization of high-performance LPDDR, DDR, HBM, and Die-to-Die interconnect systems across advanced semiconductor process technologies. You will work at the intersection of circuit design, system architecture, signal integrity, power delivery, and SoC integration, helping define and deliver industry-leading memory and interconnect solutions for future Snapdragon and Dragonfly platforms.

This role offers a unique opportunity to influence system-level architecture decisions, develop advanced behavioural and electrical models, and collaborate across PHY, controller, package, silicon, and platform teams to solve some of the industry's most challenging high-speed design problems.

Role Overview

The successful candidate will contribute to the architecture, modelling, analysis, and validation of memory and chip-to-chip systems from concept through silicon bring-up.

You will work closely with analog, digital, package, product, and validation teams to evaluate architectural trade-offs, develop predictive models, analyze power and performance bottlenecks, and ensure robust operation across a wide range of process, voltage, temperature, and application conditions.

This position is ideal for engineers with a passion for high-speed interfaces, system modelling, signal integrity, power integrity, and advanced SoC architectures.

Responsibilities

System Architecture & Definition

• Develop and evaluate architectures for next-generation LPDDR, DDR, HBM, and Die-to-Die communication systems.

• Analyze system-level trade-offs involving bandwidth, latency, power, area, reliability, and performance.

• Define system requirements and contribute to technical specifications for memory and D2D subsystems.

• Collaborate with internal product teams and industry standards organizations to influence future memory and interconnect technologies.

System Modelling & Analysis

• Develop behavioural and electrical models of memory and die-to-die communication systems.

• Create simulation environments to evaluate performance, timing margins, jitter, noise, and power consumption.

• Perform system-level validation of PHY, Controller, Package, and SoC interactions.

• Analyze protocol, timing, and performance behaviour under realistic workloads and operating conditions.

Signal Integrity & Power Integrity

• Drive or contribute signal integrity (SI) and power integrity (PI) analysis for high-speed memory and interconnect interfaces.

• Evaluate channel characteristics, package effects, PDN behaviour, noise coupling, and jitter budgets.

• Develop methodologies to optimize signal quality, timing margins, and system robustness.

• Work closely with package and board teams to ensure system-level integrity targets are achieved.

Technology & Silicon Development

• Investigate the impact of advanced technology nodes, packaging solutions, and integration approaches on memory subsystem performance.

• Support pre-silicon and post-silicon validation activities.

• Perform correlation between simulation results and silicon measurements.

• Analyze silicon characterization data and develop recommendations for future product generations.

Cross-Functional Collaboration

• Work closely with analog, digital, firmware, package, product engineering, and validation teams.

• Participate in design reviews and technical planning activities.

• Contribute to innovation, methodology development, and technical leadership across the organization.

Preferred Skills and Experience

Education

• Master's or Ph.D. degree in Electrical Engineering, Electronic Engineering, Computer Engineering, Physics, or related discipline.

Technical Expertise

• Experience in high-speed memory interfaces, chip-to-chip communication systems, SerDes, or related technologies.

• Strong understanding of signal integrity, power integrity, and high-speed system design principles.

• Experience developing behavioural, architectural, or electrical models using MATLAB, Python, SystemC, Verilog-AMS, or similar environments.

• Knowledge of channel modelling, equalization techniques, jitter analysis, and timing closure methodologies.

• Familiarity with package, board, and system-level design considerations.

• Understanding of DDR/LPDDR, HBM, UCIe, PCIe, CXL, or related industry technologies is highly desirable.

• Experience with SPICE simulation tools and electrical modelling workflows.

Professional Skills

• Strong analytical and problem-solving capabilities.

• Ability to communicate complex technical concepts to multidisciplinary teams.

• Demonstrated capability to work effectively within large, globally distributed engineering organizations.

• Passion for innovation and continuous improvement.

Minimum Qualifications

We are hiring across multiple experience levels; the scope of technical ownership and responsibilities will be matched to the successful candidate’s experience and expertise.

• Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, or a related technical discipline.

• 2+ years of industry experience in semiconductor, high-speed interface, memory systems, communications systems, or related fields.

• Experience in one or more of the following areas:

  • System architecture and modelling

  • Signal integrity or power integrity analysis

  • Memory subsystem development

  • Chip-to-chip interconnect technologies

  • Analog/mixed-signal design

  • Silicon validation and characterization

Where you will be working

Cork has a proud reputation as Ireland's second largest economic engine and is now one of the Top 20 location choices in Europe with 39,000 people being employed by over 170 overseas companies.
There's a growing diversity in the region with people from many nationalities relocating to Cork, relishing the opportunity to work and live in a location that offers an excellent quality of life.
A gateway to Europe, Cork airport provides access to almost 50 international destinations including transatlantic air routes.

Equal Opportunities
We are an Equal Opportunity employer; all qualified applicants will receive consideration for employment without regard to race, colour, religion, sexual orientation, gender identity, national origin, disability, veteran status, or any protected classification.
What's on Offer

Apart from working in an open, relaxed and collaborative space, you will enjoy:

• Salary, stock and performance related bonus

• Maternity/Paternity Leave

• Employee stock purchase scheme

• Matching pension scheme

• Education Assistance

• Relocation and immigration support (if needed)

• Life, Medical, Income and Travel Insurance

• Subsidised memberships for physical and mental well-being

• Bicycle purchase scheme

• Employee run clubs, including, running, football, chess, badminton + many more

Minimum Qualifications:

• Bachelor's degree in Science, Engineering, or related field.

*References to a particular number of years experience are for indicative purposes only. Applications from candidates with equivalent experience will be considered, provided that the candidate can demonstrate an ability to fulfill the principal duties of the role and possesses the required competencies.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

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