Advanced Packaging Process Engineer III (E3)

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

What We Offer

Salary:

$124,000.00 - $171,000.00

Location:

Santa Clara,CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. 

Role Responsibilities: 

• Design, collect data, analyze, and compile reports on difficult process engineering experiments
• Perform hardware characterization on a variety of difficult systems
• Troubleshoot complex problems, perform Root Cause Analysis, and resolve a variety of difficult process engineering issues
• Measure film properties and interpret data
• Generate internal documentation for products, presentations, and technical reports
• Communicate and engage with customers to resolve complex process engineering issues or concerns, under limited supervision
• Identify, select, and partner with vendors and suppliers
• Implement new technology, products, and analytical instrumentation
• Serve as a resource for junior colleagues; lead project teams, as needed

Minimum Qualifications:

• BS or MS Degree in Electrical, Chemical or Mechanical Engineering, Materials Science, Physics, or a related field
• 4-7 years of related experience  
• Demonstrates conceptual and practical expertise in complex problem solving

• Experience with electronic packaging fabrication such W2W and D2W bonding
• Previous hand-on experience with tool operation and process development in PCB or semiconductor industry.

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.