Senior SI/PI Engineer (High-Speed Systems)

Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

General Summary:

The Qualcomm CHS (Central Hardware Systems) team is seeking an engineer to support SI/PI (Signal Integrity/Power Integrity) for components in high-speed systems.

The candidate will work with components such as connectors, repeaters, capacitors, and optical devices. Responsibilities include performing component- and system-level simulations, evaluating system performance, and ensuring compliance with channel and component specifications.

The candidate will collaborate with external vendors to obtain, optimize, and debug component models. They will also work with business unit (BU), IP, package, and PCB design teams to define component requirements and develop solutions for Qualcomm productsㄡ

The responsibilities will include but not be limited to the following:

• Collaborate with vendors to obtain, optimize, and debug component models, including technical specification negotiations
• Perform component- and system-level simulations using validated models
• Work with BU and IP teams to define component, channel, and system requirements
• Evaluate component performance against system and channel specifications
• Support package and PCB design teams with component recommendations and design requirements
• Maintain and enhance the component model library

Minimum Qualifications

• Experience in SI/PI, including a strong understanding of electromagnetics and transmission-line theory

• Experience with electromagnetic field solvers such as HFSS, Q3D, or Clarity

• Experience with circuit and system simulation tools such as ADS and HSPICE

• Working knowledge of CAD tools such as Cadence Allegro or Mentor Xpedition

• Master’s degree in Electrical Engineering, Computer Engineering, or a related field

Preferred Qualifications

• Experience developing or characterizing high-speed electrical or optical components

• Experience with package or PCB design

• Experience with interface specifications such as LPDDR, PCIe, or UCIe

• Experience with co-packaged copper (CPC) or co-packaged optics (CPO)

• Experience collaborating with component vendors and cross-functional engineering teams

• Industry experience preferred

Minimum Qualifications:

•    Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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