SIPI Engineer, Sr.
Qualcomm · San Diego, United States · 5d ago
Company:
Qualcomm Technologies, Inc.Job Area:
Engineering Group, Engineering Group > Packaging EngineeringGeneral Summary:
The Qualcomm CHS (Central Hardware System) has exciting opportunities in the areas of signal integrity and power integrity in next generation server project. The candidate will work with IC, Package and PBC designers to find ways to optimize the overall System performance. The candidate’s first responsibility is working with substrate designers to make sure all system level constraints are met prior to the package Tape-out. The candidate is expected to communicate with PHY owners to understand the Specs for various IPs such as LP6, PCIe, 224G, etc, and also with PCB designers to assess the impact of Ball assignment to the system level performance. This position offers the opportunity to work across multiple organizations such as IP, PKG & PCB design and simulation teams.
The responsibilities will include but not be limited to the following:
•Perform package extraction for the time domain and frequency domain analysis
•Perform system-level analysis for DDR, SerDes & PDN analysis
•Develop design guidelines for Package and PCB design
•Create technical documentation and presentations
Preferred Qualifications:
•3+ years of experience in DDR/SerDes in Package/PCB/System Design related to compute, Auto and/or Server projects
•Experience in Electromagnetics and solid background on transmission line theory & Crosstalk
•Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI and Clarity
•Experience in simulation tools such as ADS and Hspice
•Working knowledge in Cadence Allegro/APD/Sip or Mentor Xpedition
•Experience in utilizing AI to gain efficiency is a strong plus.
•Experience in Matlab
•Experience in design specifications such as LPDDRx, PCIe, Xlink
•Master Degree with 3 ~ 4 years of experiences is preferred, Ph.D with minimal experience is considered as well
Minimum Qualifications:
• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field.
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Pay range and Other Compensation & Benefits:
$133,900.00 - $200,900.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.