Packaging SIPI Engineer, Sr. Staff
Qualcomm · San Diego, United States · 10d ago
Company:
Qualcomm Technologies, Inc.Job Area:
Engineering Group, Engineering Group > Packaging EngineeringGeneral Summary:
The Qualcomm Package Electrical Team has an opening in the areas of signal integrity and power integrity. The candidate will work with package and IC designers to find ways to optimize the overall package design and perform system simulation to make sure all system level constraints are met prior to the package Tape-out. The candidate is expected to communicate with PHY owners to understand the Specs for various IPs such as LPDDR, PCIe, UFS, USB, MIPI, etc., and with PCB designers to assess the impact of Ball assignment to the system level performance. This position offers the opportunity to work across multiple organizations such as PHY team, Package team, PCB team and providing timely feedback and updating design guidelines to the team. The candidate is expected to work on auto products by leading several engineers located in multiple internation geos. This is a leadership position, and candidate should be able to work independently and provide technical guidelines to upper management for key decision-making processes.
The responsibilities will include but not be limited to the following:
•Perform package extraction for the time domain and frequency domain analysis.
•Perform system-level analysis for DDR, SerDes & Mixed signal interfaces.
•Provide design guidelines for Package design.
•Being able to perform system simulation and provide feedback for design optimization.
•Develop design & analysis flow and automate the process.
•Create technical documentation and presentations.
Minimum Qualifications:
• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.OR
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 5+ years of System/Package Design/Technology Engineering or related work experience.
OR
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ year of System/Package Design/Technology Engineering or related work experience.
Preferred Qualifications:
•Experience in AUTO package design and analysis
•Ability to use AI to enhance team efficiency.
•Experience in SerDes design specifications such as PCIe Gen-x, USB, UFS in Server design
•Experience in Matlab to be able to automate existing simulation flow.
•Experience in programming language(c/c++) or scripting language (Perl/Python) is a plus.
•Master’s degree or Ph.D with 15+ years of experience
•Prior Management experience
•10 years of experience in DDR/SerDes in Package/PCB/System Design related to Compute/Server standards.
•Experience in Electromagnetics and solid background on transmission line theory & Crosstalk
•Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI and Clarity
•Experience in simulation tools such as ADS and Hspice
•Working knowledge in Cadence Allegro/APD/Sip or Mentor Xpedition
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Pay range and Other Compensation & Benefits:
$191,800.00 - $287,800.00The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.
If you would like more information about this role, please contact Qualcomm Careers.