Staff Signal Integrity Engineer

Company:

Qualcomm India Private Limited

Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

• System SI/PI owner across full platform (SoC ↔ package ↔ board ↔ connectors ↔ external systems)
• Technical owner for high-speed interfaces and system margins
• Cross-functional leader driving SIPI driven design convergence across silicon, package, and platform teams

• Own end-to-end SI/PI closure for programs (pre-silicon → post-silicon → production)
• Define design targets and layout design guidelines for all high-speed interfaces
• Influence architecture decisions early in product lifecycle
• Ensure SI/PI alignment with product KPIs (performance, yield, power, cost)
• Drive new IP co-design across IC/IO/PHY, package, and PCB
• Ensure compliance to standards (JEDEC, PCI-SIG, MIPI, IEEE)
• Influence PDN architecture definition at system and package level, provide related optimum cost solutions
• Ensure cross functional alignments. Partner with SoC/PHY design teams, Package engineering, Board/system teams and OEM/ODM ecosystem
• Lead design reviews and signoff decisions
• Represent SI/PI in program reviews and leadership forums
• Define company-wide SI/PI methodologies
• Drive correlation between pre-silicon models and silicon/lab data
• Lead debug of eye collapse / jitter margin issues, crosstalk and power noise and silicon-package-board interactions
• Drive best practices adoption across programs
• Establish golden methods for system SI/PI
• Mentor senior engineers across SI/PI domains

• Memory: LPDDR4/5/6
• High-speed IO: PCIe Gen4/5/6/7, USB4, UFS, 10G–112G+ PHYs
• Camera/Display: MIPI CSI/DSI
• System PDN

• 12+ years in Signal Integrity / Power Integrity / High-speed systems
• Proven ownership of multiple tapeouts or high-volume products

• Experience with: Packaging technologies like FCBGA, 2.5D/3D; Products like Data center, Compute and Servers
• Track record of Patents, standards contributions, or published work internal / external conferences

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.

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